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Your present location:indexIndustry CategoryElectronic Packaging Materials > Cu/Mo/Cu(CMC) Heat Sink
Detail
  • Product Name  Cu/Mo/Cu(CMC) Heat Sink
  • Product ID  f5
  • Added time  2017-03-03
  • Views   822

Description:

Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Product Properties:

Grade

Density g/cm3

Coefficient of thermal

Expansion ×10-6  (20℃)

Thermal conductivity W/(M·K)

CMC111

9.32

8.8

305XY/250Z

CMC121

9.54

7.8

260XY/210Z

CMC131

9.66

6.8

244XY/190Z

CMC141

9.75

6

220XY/180Z

CMC13/74/13

9.88

5.6

200XY/170Z

Material

Wt%
Molybdenum Content

g/cm3
Density

Thermal conductivity at 25℃

Coefficient of thermal
expansion
at 25℃

S-CMC

5

9.0

362

14.8

10

9.0

335

11.8

13.3

9.1

320

10.9

20

9.2

291

7.4

 

 

 

 

Application:

Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.

S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.

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